Launching of 1st pilots for PCM X-Bond technology

PCM Artificial Lift Solutions is pleased to have launched its first pilots of its patented X-Bond technology. PCM has entered into an important phase deploying multiple PCPs embedding the latest X-Bond technology, with the aim of demonstrating PCP’s as a highly resilient solution for thermal applications.

1st pilot for the patented PCM X-Bond technology in a thermal application.

PCM high temperature elastomer combined with its unique patented mechanical anchoring provides extreme bonding, enabling PCP’s to maximize run-life and performance for temperatures exceeding 100°C. This will bring a valuable alternate to extend elastomer PCP operation in thermal operations.

To learn more about PCM X-Bond technology, click here